Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Prif Awdur:	Muhammad Nubli Bin Zulkifli (Awdur)
Awdur Corfforaethol:	Universiti Malaysia Perlis
Fformat:	Traethawd Ymchwil Llyfr
Iaith:	English
Cyhoeddwyd:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Pynciau:	Ball grid array technology Chip scale packaging
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Eitemau Tebyg

Ball grid array technolog : edited by John H Lau.
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Area array packaging materials : adhesives, pastes and lead-free /
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Area array packaging handbook manufacturing and assembley
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Area array packaging handbook manufacturing and assembley
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Cyhoeddwyd: (2002)

Area array packing handbook : manufacturing and assembly /
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Area array packing handbook : manufacturing and assembly /
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Foldable flex and thinned silicon multichip packaging technology /
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Advanced flip chip packaging /
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Advanced flip chip packaging
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Advanced flip chip packaging
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Semiconductor packaging : a multidisciplinary approach /
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Area array package design : techniques in high-density electronics /
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Area array package design : techniques in high-density electronics /
Cyhoeddwyd: (2004)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
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Cyhoeddwyd: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
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Cyhoeddwyd: (2017)

Semiconductor packaging : materials interaction and reliability /
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Semiconductor packaging : materials interaction and reliability /
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Electronic packaging : design, materials, process, and reliability /
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Microelectronic packaging /
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Microelectronic packaging /
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Semiconductor Packaging (EMT 453/3) /

Packaging, reliability and manufacturing issues associated with electronic and photonic products /
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Fundamentals of microsystems packaging
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Principles of electronic packaging /
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Introduction to microsystem packaging technology /
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Electronic packaging : materials and their properties /
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Packaging of electronic systems : a mechanical engineering approach /
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Journal of electronic packaging.
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Materials for electronic packaging /
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gan: Jamnia, Ali
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
gan: Jamnia, Ali
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Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
gan: Jamnia, Ali, 1961-
Cyhoeddwyd: (2003)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
gan: Liu, Sheng
Cyhoeddwyd: (2011)

Bio and nano packaging techniques for electron devices /
Cyhoeddwyd: (2012)