Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Αποθηκεύτηκε σε:

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Muhammad Nubli Bin Zulkifli (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	Universiti Malaysia Perlis
Μορφή:	Thesis Βιβλίο
Γλώσσα:	English
Έκδοση:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Θέματα:	Ball grid array technology Chip scale packaging
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!

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