Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Sábháilte in:

Sonraí bibleagrafaíochta
Príomhchruthaitheoir:	Muhammad Nubli Bin Zulkifli (Údar)
Údar corparáideach:	Universiti Malaysia Perlis
Formáid:	Tráchtas LEABHAR
Teanga:	English
Foilsithe / Cruthaithe:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Ábhair:	Ball grid array technology Chip scale packaging
Clibeanna:	Cuir clib leis Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!

Míreanna comhchosúla

Ball grid array technolog : edited by John H Lau.
Foilsithe / Cruthaithe: (1995)

Area array packaging handbook : manufacturing and assembly /
Foilsithe / Cruthaithe: (2002)

Area array packaging materials : adhesive, paste and lead free /
de réir: Gilleo, Ken
Foilsithe / Cruthaithe: (2004)

Area array packaging materials : adhesives, pastes and lead-free /
Foilsithe / Cruthaithe: (2004)

Area array packaging handbook manufacturing and assembley
de réir: Gilleo, Ken
Foilsithe / Cruthaithe: (2002)

Area array packaging handbook manufacturing and assembley
de réir: Gilleo, Ken
Foilsithe / Cruthaithe: (2002)

Area array packing handbook : manufacturing and assembly /
de réir: Gilleo, Ken
Foilsithe / Cruthaithe: (2002)

Area array packing handbook : manufacturing and assembly /
de réir: Gilleo, Ken
Foilsithe / Cruthaithe: (2002)

Foldable flex and thinned silicon multichip packaging technology /
Foilsithe / Cruthaithe: (2003)

Advanced flip chip packaging /
Foilsithe / Cruthaithe: (2010)

Advanced flip chip packaging
Foilsithe / Cruthaithe: (2013)

Advanced flip chip packaging
Foilsithe / Cruthaithe: (2013)

Semiconductor packaging : a multidisciplinary approach /
Foilsithe / Cruthaithe: (1994)

Area array package design : techniques in high-density electronics /
Foilsithe / Cruthaithe: (2004)

Area array package design : techniques in high-density electronics /
Foilsithe / Cruthaithe: (2004)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
de réir: Lim, Ming Siong
Foilsithe / Cruthaithe: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
de réir: Lim, Ming Siong
Foilsithe / Cruthaithe: (2017)

Semiconductor packaging : materials interaction and reliability /
de réir: Chen, Andrea
Foilsithe / Cruthaithe: (2012)

Semiconductor packaging : materials interaction and reliability /
de réir: Chen, Andrea
Foilsithe / Cruthaithe: (2012)

Electronic packaging : design, materials, process, and reliability /
Foilsithe / Cruthaithe: (1998)

Microelectronic packaging /
Foilsithe / Cruthaithe: (2005)

Microelectronic packaging /
Foilsithe / Cruthaithe: (2005)

Semiconductor Packaging (EMT 453/3) /

Packaging, reliability and manufacturing issues associated with electronic and photonic products /
Foilsithe / Cruthaithe: (2001)

Fundamentals of microsystems packaging
Foilsithe / Cruthaithe: (2001)

Fundamentals of microsystems packaging
Foilsithe / Cruthaithe: (2001)

Principles of electronic packaging /
Foilsithe / Cruthaithe: (1989)

Introduction to microsystem packaging technology /
de réir: Jin, Yufeng
Foilsithe / Cruthaithe: (2011)

Electronic packaging : materials and their properties /
de réir: Pecht, Michael G.
Foilsithe / Cruthaithe: (1999)

Packaging of electronic systems : a mechanical engineering approach /
de réir: Dally, James W.
Foilsithe / Cruthaithe: (1990)

Journal of electronic packaging.
Foilsithe / Cruthaithe: (1989)

Principles of electronic packaging /
Foilsithe / Cruthaithe: (1989)

Materials for electronic packaging /
Foilsithe / Cruthaithe: (1995)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
de réir: Jamnia, Ali
Foilsithe / Cruthaithe: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
de réir: Jamnia, Ali
Foilsithe / Cruthaithe: (2009)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
de réir: Jamnia, Ali, 1961-
Foilsithe / Cruthaithe: (2003)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
de réir: Liu, Sheng
Foilsithe / Cruthaithe: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
de réir: Liu, Sheng
Foilsithe / Cruthaithe: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
de réir: Liu, Sheng
Foilsithe / Cruthaithe: (2011)

Bio and nano packaging techniques for electron devices /
Foilsithe / Cruthaithe: (2012)