Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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Opis bibliograficzny
1. autor:	Muhammad Nubli Bin Zulkifli (Autor)
Korporacja:	Universiti Malaysia Perlis
Format:	Praca dyplomowa Książka
Język:	English
Wydane:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
Hasła przedmiotowe:	Ball grid array technology Chip scale packaging
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

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