Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Saved in:

書目詳細資料
主要作者:	Muhammad Nubli Bin Zulkifli (Author)
企業作者:	Universiti Malaysia Perlis
格式:	Thesis 圖書
語言:	English
出版:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
主題:	Ball grid array technology Chip scale packaging
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Ball grid array technolog : edited by John H Lau.
出版: (1995)

Area array packaging handbook : manufacturing and assembly /
出版: (2002)

Area array packaging materials : adhesive, paste and lead free /
由: Gilleo, Ken
出版: (2004)

Area array packaging materials : adhesives, pastes and lead-free /
出版: (2004)

Area array packaging handbook manufacturing and assembley
由: Gilleo, Ken
出版: (2002)

Area array packaging handbook manufacturing and assembley
由: Gilleo, Ken
出版: (2002)

Area array packing handbook : manufacturing and assembly /
由: Gilleo, Ken
出版: (2002)

Area array packing handbook : manufacturing and assembly /
由: Gilleo, Ken
出版: (2002)

Foldable flex and thinned silicon multichip packaging technology /
出版: (2003)

Advanced flip chip packaging /
出版: (2010)

Advanced flip chip packaging
出版: (2013)

Advanced flip chip packaging
出版: (2013)

Semiconductor packaging : a multidisciplinary approach /
出版: (1994)

Area array package design : techniques in high-density electronics /
出版: (2004)

Area array package design : techniques in high-density electronics /
出版: (2004)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
由: Lim, Ming Siong
出版: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
由: Lim, Ming Siong
出版: (2017)

Semiconductor packaging : materials interaction and reliability /
由: Chen, Andrea
出版: (2012)

Semiconductor packaging : materials interaction and reliability /
由: Chen, Andrea
出版: (2012)

Electronic packaging : design, materials, process, and reliability /
出版: (1998)

Microelectronic packaging /
出版: (2005)

Microelectronic packaging /
出版: (2005)

Semiconductor Packaging (EMT 453/3) /

Packaging, reliability and manufacturing issues associated with electronic and photonic products /
出版: (2001)

Fundamentals of microsystems packaging
出版: (2001)

Fundamentals of microsystems packaging
出版: (2001)

Principles of electronic packaging /
出版: (1989)

Introduction to microsystem packaging technology /
由: Jin, Yufeng
出版: (2011)

Electronic packaging : materials and their properties /
由: Pecht, Michael G.
出版: (1999)

Packaging of electronic systems : a mechanical engineering approach /
由: Dally, James W.
出版: (1990)

Journal of electronic packaging.
出版: (1989)

Principles of electronic packaging /
出版: (1989)

Materials for electronic packaging /
出版: (1995)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
由: Jamnia, Ali
出版: (2003)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
由: Jamnia, Ali
出版: (2009)

Practical guide to the packaging of electronics : thermal and mechanical design and analysis /
由: Jamnia, Ali, 1961-
出版: (2003)

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing /
由: Liu, Sheng
出版: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
由: Liu, Sheng
出版: (2011)

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
由: Liu, Sheng
出版: (2011)

Bio and nano packaging techniques for electron devices /
出版: (2012)