Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

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书目详细资料
主要作者:	Muhammad Nubli Bin Zulkifli (Author)
企业作者:	Universiti Malaysia Perlis
格式:	Thesis 图书
语言:	English
出版:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
主题:	Ball grid array technology Chip scale packaging
标签:	添加标签没有标签, 成为第一个标记此记录!

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