Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

में बचाया:

ग्रंथसूची विवरण
मुख्य लेखक:	Muhammad Nubli Bin Zulkifli (लेखक)
निगमित लेखक:	Universiti Malaysia Perlis
स्वरूप:	थीसिस पुस्तक
भाषा:	English
प्रकाशित:	Kangar Universiti Malaysia Perlis (UniMAP) 2008
विषय:	Ball grid array technology Chip scale packaging
टैग :	टैग जोड़ें कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!

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