The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications /
The thermophysical properties of Cu-SiCp composites can be optimized by improving the bonding between the copper matrix and SiCp reinforcement. This can be done via an electroless coating process.
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| Format: | Thesis Book |
| Language: | English |
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Perlis, Malaysia
School of Materials Engineering
2013.
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