APA (7th ed.) Citation

Azmi Kamardin. (2013). The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications. School of Materials Engineering.

Chicago Style (17th ed.) Citation

Azmi Kamardin. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications. Perlis, Malaysia: School of Materials Engineering, 2013.

MLA (8th ed.) Citation

Azmi Kamardin. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications. School of Materials Engineering, 2013.