The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications /
The thermophysical properties of Cu-SiCp composites can be optimized by improving the bonding between the copper matrix and SiCp reinforcement. This can be done via an electroless coating process.
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| Corporate Author: | |
| Format: | Thesis Book |
| Language: | English |
| Published: |
Perlis, Malaysia
School of Materials Engineering
2013.
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| 008 | 151212s2012 my a f bm 000 0 eng d | ||
| 035 | |a (OCoLC)ocn932053429 | ||
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| 100 | 0 | |a Azmi Kamardin., |e author | |
| 245 | 1 | 4 | |a The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications / |c Azmi Kamardin. |
| 264 | 1 | |a Perlis, Malaysia |b School of Materials Engineering |c 2013. | |
| 300 | |a 108 pages |b illustrations |c 30 cm | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a unmediated |b n |2 rdamedia | ||
| 338 | |a volume |b nc |2 rdacarrier | ||
| 502 | |a Thesis (Master of Science)--Universiti Malaysia Perlis. School of Materials Engineering, 2013. | ||
| 504 | |a Includes bibliographical references (pages 87-92). | ||
| 520 | 3 | |a The thermophysical properties of Cu-SiCp composites can be optimized by improving the bonding between the copper matrix and SiCp reinforcement. This can be done via an electroless coating process. | |
| 541 | |a Gift from Centre for Graduate Studies | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Electroless plating. | |
| 710 | 2 | |a Universiti Malaysia Perlis | |
| 720 | 1 | ||
| 790 | 1 | |a School of Materials Engineering | |
| 791 | 1 | |a Master of Science | |
| 792 | 1 | |a 2013 | |
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