Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Gorde:

Xehetasun bibliografikoak
Beste egile batzuk:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
Formatua:	Liburua
Hizkuntza:	English
Argitaratua:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
Edizioa:	Second edition.
Gaiak:	Microelectronic packaging.
Etiketak:	Etiketa erantsi Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!

Antzeko izenburuak

Advanced electronic packaging /
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Advanced electronic packaging
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Materials for advanced packaging /
Argitaratua: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
Argitaratua: (1999)

Materials for advanced packaging /
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Advanced electronic packaging with emphasis on multichip modules
Argitaratua: (1999)

Advanced electronic packaging with emphasis on multichip modules
Argitaratua: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Argitaratua: (1999)

RF and microwave microelectronics packaging
Argitaratua: (2009)

RF and microwave microelectronics packaging
Argitaratua: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
Argitaratua: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
nork: Schwizer, J.
Argitaratua: (2005)

Force sensors for microelectronic packaging applications /
nork: Schwizer, J.
Argitaratua: (2005)

Bio and nano packaging techniques for electron devices /
Argitaratua: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
nork: Lau, John H.
Argitaratua: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Argitaratua: (1998)

Microelectronic packaging /
Argitaratua: (2005)

Microelectronic packaging /
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MEMS and microsystems : design and manufacture /
nork: Hsu, Tai-Ran
Argitaratua: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
nork: Hsu, Tai-Ran
Argitaratua: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
nork: Hsu, Tai-Ran
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Semiconductor packaging : materials interaction and reliability /
nork: Chen, Andrea
Argitaratua: (2012)

Semiconductor packaging : materials interaction and reliability /
nork: Chen, Andrea
Argitaratua: (2012)

Advanced MEMS packaging /
Argitaratua: (2010)

Advanced MEMS packaging
Argitaratua: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
nork: Jin, Yufeng
Argitaratua: (2011)

RF and microwave microelectronics packaging II
Argitaratua: (2017)

RF and microwave microelectronics packaging II
Argitaratua: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
nork: Pecht, Michael
Argitaratua: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
nork: Lau, John H.
Argitaratua: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
nork: Lau, John H.
Argitaratua: (1999)

Mems packaging /
Argitaratua: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
nork: Siti Amaniah Mohd Chachuli
Argitaratua: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
nork: Siti Amaniah Mohd Chachuli
Argitaratua: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
nork: Lau, John H.
Argitaratua: (2000)