Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown.

Сохранить в:

Библиографические подробности
Другие авторы:	Brown, William D., 1943-, Ulrich, Richard K. Ph.D
Формат:	‌
Язык:	English
Опубликовано:	Hoboken, NJ Wiley-Interscience/IEEE c2006.
Редактирование:	Second edition.
Предметы:	Microelectronic packaging.
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

Схожие документы

Advanced electronic packaging /
Опубликовано: (2006)

Advanced electronic packaging
Опубликовано: (2006)

Advanced electronic packaging
Опубликовано: (2006)

Advanced electronic packaging /
Опубликовано: (2006)

Materials for advanced packaging /
Опубликовано: (2009)

Advanced electronic packaging : with emphasis on multichip modules /
Опубликовано: (1999)

Materials for advanced packaging /
Опубликовано: (2009)

Advanced electronic packaging with emphasis on multichip modules
Опубликовано: (1999)

Advanced electronic packaging with emphasis on multichip modules
Опубликовано: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Опубликовано: (1999)

RF and microwave microelectronics packaging
Опубликовано: (2009)

RF and microwave microelectronics packaging
Опубликовано: (2009)

Area array packaging processes : for BGA, flip chip and CSP /
Опубликовано: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Force sensors for microelectronic packaging applications /
по: Schwizer, J.
Опубликовано: (2005)

Force sensors for microelectronic packaging applications /
по: Schwizer, J.
Опубликовано: (2005)

Bio and nano packaging techniques for electron devices /
Опубликовано: (2012)

Chip scale package (CSP) : design, materials, processes, reliability and application /
по: Lau, John H.
Опубликовано: (1999)

Advanced electronic packaging : with emphasis on multichip modules /
Опубликовано: (1998)

Microelectronic packaging /
Опубликовано: (2005)

Microelectronic packaging /
Опубликовано: (2005)

MEMS and microsystems : design and manufacture /
по: Hsu, Tai-Ran
Опубликовано: (2002)

Mems and microsystems : design, manufacture, and nanoscale engineering
по: Hsu, Tai-Ran
Опубликовано: (2008)

MEMS and microsystems : design, manufacture and nanoscale engineering /
по: Hsu, Tai-Ran
Опубликовано: (2008)

Semiconductor packaging : materials interaction and reliability /
по: Chen, Andrea
Опубликовано: (2012)

Semiconductor packaging : materials interaction and reliability /
по: Chen, Andrea
Опубликовано: (2012)

Advanced MEMS packaging /
Опубликовано: (2010)

Advanced MEMS packaging
Опубликовано: (2010)

Advanced MEMS packaging /

Introduction to microsystem packaging technology /
по: Jin, Yufeng
Опубликовано: (2011)

RF and microwave microelectronics packaging II
Опубликовано: (2017)

RF and microwave microelectronics packaging II
Опубликовано: (2017)

Plastic encapsulated microelectronics : materials, processes, quality, reliability, and applications /
по: Pecht, Michael
Опубликовано: (1995)

Chip scale package (CSP) design, materials, processes, reliability, and applications
по: Lau, John H.
Опубликовано: (1999)

Chip scale package (CSP) design, materials, processes, reliability, and applications
по: Lau, John H.
Опубликовано: (1999)

Mems packaging /
Опубликовано: (2004)

Semiconductor Packaging (EMT 453/3) /

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
по: Siti Amaniah Mohd Chachuli
Опубликовано: (2012)

Design of interface circuit using dual- chopper amplifier for CMOS- MEMS applications
по: Siti Amaniah Mohd Chachuli
Опубликовано: (2012)

Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
по: Lau, John H.
Опубликовано: (2000)