Semiconductor packaging : a multidisciplinary approach /

Semiconductor packaging : a multidisciplinary approach /

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Détails bibliographiques
Autres auteurs:	Kraus, Allan D., Pecht, Michael, Hannemann, Robert J. 1948-
Format:	Livre
Langue:	English
Publié:	New York John Wiley & Sons 1994
Sujets:	Electronic packaging. Integrated circuits > Very large scale integration.
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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