Proceedings of the 6th International conference on electronic materials and packaging (EMAP 2004) : December 5 -7, 2004, Penang, Malaysia /

Proceedings of the 6th International conference on electronic materials and packaging (EMAP 2004) : December 5 -7, 2004, Penang, Malaysia /

Saved in:
Bibliographic Details
Corporate Author: International Conference Electronics Materials and Packaging Penang, Malaysia ).
Other Authors: Zaidi Mohd. Ripin
Format: Conference Proceeding Book
Language:English
Published: Penang Pusat Pengajian Kejuruteraan Mekanikal, Universiti Sains Malaysia, Nibong Tebal, Penang 2004.
Subjects:
Electronic packaging > Materials > Congresses
Tags: Add Tag
No Tags, Be the first to tag this record!

System Under Maintenance

Our Library Management System is currently under maintenance.

Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance:

david@pintaran.my

Similar Items