Proceedings of the 6th International conference on electronic materials and packaging (EMAP 2004) : December 5 -7, 2004, Penang, Malaysia /

Proceedings of the 6th International conference on electronic materials and packaging (EMAP 2004) : December 5 -7, 2004, Penang, Malaysia /

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Bibliographic Details
Corporate Author: International Conference Electronics Materials and Packaging Penang, Malaysia ).
Other Authors: Zaidi Mohd. Ripin
Format: Conference Proceeding Book
Language:English
Published: Penang Pusat Pengajian Kejuruteraan Mekanikal, Universiti Sains Malaysia, Nibong Tebal, Penang 2004.
Subjects:
Electronic packaging > Materials > Congresses
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