Area array packaging processes : for BGA, Flip Chip, and CSP /

समान संसाधन

• Area array packaging processes : for BGA, flip chip and CSP /
  प्रकाशित: (2004)
• Advanced electronic packaging : with emphasis on multichip modules /
  प्रकाशित: (1999)
• Low cost flip chip technologies : for DCA WLCSP, and PBGA assemblies /
  द्वारा: Lau, John H.
  प्रकाशित: (2000)
• Advanced electronic packaging with emphasis on multichip modules
  प्रकाशित: (1999)
• Advanced electronic packaging with emphasis on multichip modules
  प्रकाशित: (1999)