Characterization of electroless under bump metallury for AlSi bond pad composition

Characterization of electroless under bump metallury for AlSi bond pad composition

The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...

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Sonraí bibleagrafaíochta
Príomhchruthaitheoir:	Norahmad Barzrul Basaruddin (Údar)
Formáid:	Leictreonach Bogearraí Bunachar sonraí
Teanga:	English
Ábhair:	Microelectronics.
Clibeanna:	Cuir clib leis Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!

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