Characterization of electroless under bump metallury for AlSi bond pad composition

Characterization of electroless under bump metallury for AlSi bond pad composition

The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up proc...

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書誌詳細
第一著者:	Norahmad Barzrul Basaruddin (著者)
フォーマット:	電子媒体ソフトウェアデータベース
言語:	English
主題:	Microelectronics.
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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