Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
In this final year project, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to...
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| 第一著者: | |
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| フォーマット: | 電子媒体 ソフトウェア データベース |
| 言語: | English |
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| 要約: | In this final year project, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to determined which type of EMC show a better moldability performance. |
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| 記述事項: | Final Year Project |
| 物理的記述: | 1 CD-ROM 4 3/4 in. |