Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
In this final year project, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to...
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| Fformat: | Electronig Meddalwedd Cronfa ddata |
| Iaith: | English |
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Ychwanegu Tag
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Gwaith Cynnal a Chadw ar y Gweill
Rydym yn gwneud gwaith cynnal a chadw ar ein System Rheoli'r Llyfrgell ar hyn o bryd
Nid yw gwybodaeth am y stoc nac am argaeledd yr eitemau ar gael ar hyn o bryd. Rydym yn ymddiheuro am unrhyw anhwylustod. Cysylltwch â ni am ragor o wybodaeth.