Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Gorde:
Egile nagusia: | Mohd Jaffry Radzi (Egilea) |
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Formatua: | Baliabide elektronikoa Software Datu-basea |
Hizkuntza: | English |
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Antzeko izenburuak
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Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
nork: Nurul Ashikin Saleh
Argitaratua: (2017) -
Effect of corrosion in acidic solution to the phase and microstructure of sn-cu solder/
nork: Gan, Zhi Wan
Argitaratua: (2016) -
Effect of polarization scan rate on corrosion in acidic solution to the properties of Sn-Cu solder/
nork: Low, Suk Yen
Argitaratua: (2016) -
Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
nork: Nur Syahirah Mohamad Zaimi
Argitaratua: (2017) -
Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
nork: Syahirah Alyaa Yahya
Argitaratua: (2016)