Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Tallennettuna:
Päätekijä: | Mohd Jaffry Radzi (Tekijä) |
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Aineistotyyppi: | Elektroninen Tietokoneohjelma Tietokanta |
Kieli: | English |
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