Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Sábháilte in:
Príomhchruthaitheoir: | Mohd Jaffry Radzi (Údar) |
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Formáid: | Leictreonach Bogearraí Bunachar sonraí |
Teanga: | English |
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Míreanna comhchosúla
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Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
de réir: Nurul Ashikin Saleh
Foilsithe / Cruthaithe: (2017) -
Effect of corrosion in acidic solution to the phase and microstructure of sn-cu solder/
de réir: Gan, Zhi Wan
Foilsithe / Cruthaithe: (2016) -
Effect of polarization scan rate on corrosion in acidic solution to the properties of Sn-Cu solder/
de réir: Low, Suk Yen
Foilsithe / Cruthaithe: (2016) -
Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
de réir: Nur Syahirah Mohamad Zaimi
Foilsithe / Cruthaithe: (2017) -
Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
de réir: Syahirah Alyaa Yahya
Foilsithe / Cruthaithe: (2016)