Aging effect of sn-ag-cu lead free solder

Aging effect of sn-ag-cu lead free solder

This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...

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Библиографические подробности
Главный автор:	Mohd Jaffry Radzi (Автор)
Формат:	Электронный ресурс Программное обеспечение База данных
Язык:	English
Предметы:	Metallurgy.
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

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