Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Tallennettuna:
| Päätekijä: | |
|---|---|
| Aineistotyyppi: | Elektroninen Tietokoneohjelma Tietokanta |
| Kieli: | English |
| Aiheet: | |
| Tagit: |
Lisää tagi
Ei tageja, Lisää ensimmäinen tagi!
|
Lisää ensimmäinen kommentti!