Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Bewaard in:
| Hoofdauteur: | |
|---|---|
| Formaat: | Elektronisch Software Databank |
| Taal: | English |
| Onderwerpen: | |
| Tags: |
Voeg label toe
Geen labels, Wees de eerste die dit record labelt!
|
Wees de eerste die reageert!