Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20...
Tallennettuna:
| Päätekijä: | |
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| Aineistotyyppi: | Opinnäyte Tietokoneohjelma E-kirja |
| Kieli: | English |
| Julkaistu: |
Perlis, Malaysia
School of Materials Engineering, University Malaysia Perlis
2016
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| Aiheet: | |
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