Ng, S. L. (2016). Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire.
Chicago Style (17th ed.) CitationNg, Shay Lee. Bondability and Reliability Study on Various Silver Plated Copper Leadframe with 25um Wire Diameter of Gold and Copper Wire. 2016.
MLA citiranjeNg, Shay Lee. Bondability and Reliability Study on Various Silver Plated Copper Leadframe with 25um Wire Diameter of Gold and Copper Wire. 2016.
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