Effect of pad roughness on shear strength of thin small leadless package /
Thin Small Leadless Packages (TSLP) have been manufactured to cater the current industry demand for a smaller electronic apparatus with a higher electrical performance. Previous studies showed the solder joint strength of leadless package with the printed circuit board (PCB) using Ni-P/Sn-0.5 Ag sol...
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2018.
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Perpustakaan Laman Hikmah Kampus Induk, UTeM: 1
| Call Number: |
TK7868.P7 .O53 2018 |
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| Copy Unknown | Available Place a Hold |