Experimental investigation of mechanical dicing parameters on the quality of thin glass wafer cutting process /

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...

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Bibliographic Details
Main Author: Liou, Jacqueline Jing Wen (Author)
Format: Software eBook
Language:English
Published: 2020.
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Unit Digital, Perpustakaan Laman Hikmah Kampus Induk, UTeM: 1

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Call Number: TJ1186 .L56 2020
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Unit Digital, Perpustakaan Laman Hikmah Kampus Induk, UTeM: 5

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Call Number: CDR 21729
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