Liou, J. J. W. (2020). Experimental investigation of mechanical dicing parameters on the quality of thin glass wafer cutting process.
Chicago Style (17th ed.) CitationLiou, Jacqueline Jing Wen. Experimental Investigation of Mechanical Dicing Parameters on the Quality of Thin Glass Wafer Cutting Process. 2020.
MLA (8th ed.) CitationLiou, Jacqueline Jing Wen. Experimental Investigation of Mechanical Dicing Parameters on the Quality of Thin Glass Wafer Cutting Process. 2020.
Warning: These citations may not always be 100% accurate.