Experimental investigation of mechanical dicing parameters on the quality of thin glass wafer cutting process /
Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...
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| Format: | Software eBook |
| Language: | English |
| Published: |
2020.
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