Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /

Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /

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Détails bibliographiques
Auteur principal:	Chen, Wei Keat (Auteur)
Format:	Logiciel eBook
Langue:	English
Publié:	2014.
Sujets:	Solder and soldering. Surfaces (Technology) > Analysis. Metals > Surfaces > Testing.
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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