Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint.
שמור ב:
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| מחבר תאגידי: | |
| פורמט: | Thesis תכנה ספר אלקטרוני |
| שפה: | English |
| יצא לאור: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
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הוספת תג
אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!
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| סיכום: | The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint. |
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| תיאור פיזי: | 1 CD-ROM 12 cm. |
| ביבליוגרפיה: | Includes bibliographical references |