Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint.
Збережено в:
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| Формат: | Дисертація Програмне забезпечення eКнига |
| Мова: | English |
| Опубліковано: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
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| Резюме: | The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint. |
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| Фізичний опис: | 1 CD-ROM 12 cm. |
| Бібліографія: | Includes bibliographical references |