Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
The scope of this project is focused on the SnCu lead free solder paste reinforced with silicon carbide (SiC). The reinforcement of SnCu lead free solder paste with SiC will affect the physical and mechanical properties as well as the wettability of solder joint.
Guardado en:
| Autor principal: | |
|---|---|
| Autor Corporativo: | |
| Formato: | Tesis Software eBook |
| Lenguaje: | English |
| Publicado: |
Perlis,Malaysia
School of Materials Engineering, Universiti Malaysia Perlis
2017
|
| Materias: | |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|