Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /
In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...
Wedi'i Gadw mewn:
| Prif Awdur: | |
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| Awdur Corfforaethol: | |
| Fformat: | Traethawd Ymchwil Meddalwedd eLyfr |
| Iaith: | English |
| Cyhoeddwyd: |
Perlis, Malaysia
School of Materials Engineering
2016
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| Pynciau: | |
| Tagiau: |
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