Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique /

अन्य संस्करण दिखाएं (1)

In this research, Sn-0.7Cu solder will be added with AC particles and fabricated via powder metallurgy techniques which comprise of mixing, compacting and sintering process. The synthesis of lead-free composite solder was prepared via optimization of process parameter for powder metallurgy technique...

पूर्ण विवरण

में बचाया:

ग्रंथसूची विवरण
मुख्य लेखक:	Sayyidah Amnah Musa (लेखक)
निगमित लेखक:	Universiti Malaysia Perlis
स्वरूप:	थीसिस सॉफ्टवेयर ई-पुस्तक
भाषा:	English
प्रकाशित:	Perlis, Malaysia School of Materials Engineering 2016
विषय:	Solder and soldering Carbon composites Tin Copper Powder metallurgy
टैग :	टैग जोड़ें कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!

समान संसाधन

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